___________________________________________________________________________ http://www.union-ic.com rev.05 sep.2008 1/7 UM6401 6 line esd/emi protection for color lcd interfaces UM6401 dfn12 3 x 1.6 general description the UM6401 is a low pass filter array with int egrated tvs diodes. it is designed to suppress unwanted emi/rfi signals and provide electrostatic discharge (esd) protection in portable electronic equipment. this state-of-the-art device utilizes solid-state silicon-avalanche technology for superior clamping performance and dc electrical characterist ics. they have been optimized for protection of color lcd panels in cellular phones and other port able electronics. the device consists of six identical circuits comprised of tvs diodes for esd protection, and a resistor -capacitor network for emi/rfi filtering. a series resistor value of 100 ? and a capacitance value of 10pf are used to achieve 30db minimum attenuation from 800mhz to 2.5ghz. the tvs diodes provide effective suppression of esd voltages in excess of 15kv (air discharge) and 8kv (contact discharge) per iec 61000-4-2, level 4. the UM6401 is in a 12-pin, rohs compliant, dfn12 3x1.6 package. the leads are spaced at a pitch of 0.5mm and are finished with lead-free ni pd. the small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and pdas. applications features z color lcd protection z cell phone ccd camera lines z bottom connector cell phones z bidirectional emi/rfi filter with integrated tvs z esd protection to iec 61000-4-2 (esd) level 4, 15kv (air), 8kv (contact) z 30db minimum attenuation: 800mhz to 2.5ghz z tvs working voltage: 5v z resistor: 100 ? 15% z typical capacitance: 10pf (vr=2.5v) protection and filtering for six lines z solid-state technology pin configurations top view xx: weekly code UM6401 dfn12 3.01.6
___________________________________________________________________________ http://www.union-ic.com rev.05 sep.2008 2/7 UM6401 ordering information part number working voltage packaging type channel marking code shipping qty UM6401 5.0v dfn12 6 6401 3000/7 inch tape & reel absolute maximum ratings parameter symbol value units junction temperature t j 125 c steady-state power per resistor @ 25 p r 328 mw operating temperature range t op -40 to 85 c storage temperature range t stg -55 to 150 c maximum lead temperature for soldering t l 260 c electrical characteristics parameter symbol conditions min typ max units reverse stand-off voltage v rwm 5 v reverse breakdown voltage v br it = 1ma 6 7 8 v reverse leakage current i r v rwm = 3.0v 0.5 a total series resistance r a i r =20ma each line 85 100 115 ? total capacitance c d input to gnd, each line v r = 0v, f = 1mhz 16 20 24 pf total capacitance c d input to gnd, each line v r = 2.5v, f = 1mhz 9 10 12 pf cut-off frequency (notes) f 3db above this frequency, appreciable attenuation occurs 150 mhz notes: 50 ? source and 50 ? load termination.
___________________________________________________________________________ http://www.union-ic.com rev.05 sep.2008 3/7 UM6401 typical operating characteristics typical insertion loss s21 analog crosstalk curve (s41) 1e7 1e8 1e9 -45 -40 -35 -30 -25 -20 -15 -10 -5 s21 (db) frequency (hz) 1e7 1e8 1e9 -60 -55 -50 -45 -40 -35 -30 s41(db) frequency(hz) typical resistance vs. temperature capacitance vs. reverse voltage -40-20 0 20406080 96 97 98 99 100 101 102 103 104 resistance(ohm) temperature(celsiur scale) 012345 0.4 0.5 0.6 0.7 0.8 0.9 1.0 f=1m cj(vr)/cj(vr=0) reverse voltage - vr(v) esd clamping (+8kv contact) esd clamping (-8kv contact)
___________________________________________________________________________ http://www.union-ic.com rev.05 sep.2008 4/7 UM6401 applications information device connection the UM6401 is comprised of six identical circuits each consisting of a low pass filter for emi/rfi suppression and dual tvs diodes for esd protection. the device is in a 12-pin dfn package. electrical connection is made to the 12 pins located at the bottom of the device. a center tab serves as the ground connection. the device has a flow through design for easy layout. pin connections are noted in figure 1. all path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. recommendations for the ground connection are given below. ground connection recommendation parasitic inductance present in the board layout will affect the filtering performance of the device. as frequency increases, the effect of the inductance becomes more dominant. this effect is given by equation 1. pin identification 1 - 6 input lines 7 - 12 output lines center tab ground equation 1: the impedance of an inductor at frequency xlf xlf(l,f ) = 2 f l where: l= inductance (h) f = frequency (hz) via connections to the ground plane form rectangular wire loops or ground loop inductance as shown in figure 2. ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. bringing the ground plane closer to the signal layer (preferably the next layer) also reduces ground loop inductance. multiple vias in the device ground pad will result in a lower inductive ground loop over two exterior vias. vias with a diameter d are separated by a distance y run between layers separated by a distance x. the inductance of the loop path is given by equation 2. thus, decreasing distance x and y will reduce the loop inductance and result in better high frequency filter characteristics.
___________________________________________________________________________ http://www.union-ic.com rev.05 sep.2008 5/7 UM6401 figure 3 shows the recommended device layout. the ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). the internal vias are spaced approximately evenly from the center of the pad. the designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance (i.e. the log function in equation 2 in highly insensitive to parameter d) . where: d = diameter of the wire (in) x = length of wire loop (in) y = breath of wire loop (in)
___________________________________________________________________________ http://www.union-ic.com rev.05 sep.2008 6/7 UM6401 package information UM6401: dfn12 3.0*1.6 outline drawing dimensions millimeters symbol min typ max d 2.75 3.00 3.075 e 1.55 1.60 1.675 d1 2.10 2.20 2.30 c 0.30 0.40 0.50 a 0.545 0.575 0.605 a1 0 0.02 0.05 a2 - 0.13 - b 0.20 0.25 0.30 l 0.28 0.33 0.38 e - 0.50 - land pattern notes: 1. compound dimension: 3.01.6; 2. unit: mm; 3. general tolerance 0.05mm unless other- wise specified; 4. the layout is just for reference. tape and reel orientation
___________________________________________________________________________ http://www.union-ic.com rev.05 sep.2008 7/7 UM6401 important notice the information in this document has been carefully reviewed and is believed to be accurate. nonetheless, this document is subject to change without notice. union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. union reserves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. union semiconductor, inc add: 7f, no. 5, bibo road, shanghai 201203 tel: 021-51097928 fax: 021-51026018 website: www.union-ic.com
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